Course10210807861 lectures
Fundamentals of Micro and Nanofabrication
Prof. Sushobhan Avasthi and Prof. Shankar Selvaraja · IISc Bangalore
About
The course provides an in-depth understanding of top-down device fabrication. Focus is the unit processes typically used in micro & nanofabrication of devices. Both concepts and practical aspects are covered. Topics include crystal growth, doping, chemical vapor deposition, physical vapor deposition, photolithography, wet etching, dry etching, and packaging. The course is accessible to students from diverse backgrounds, such as materials, physics, chemistry, mechanical engineering, and electrical engineering.The course will be a derivative of NE203: Advanced Micro & Nano Fabrication Technology & Processes. Students from various departments outside CeNSE, e.g. Physics, Chemistry, ECE, DESE, IAP, routinely take the course.
INTENDED AUDIENCE : Masters students interested in fundamentals of top-down micro and nanodevice fabrication
PREREQUISITES : General background in physics, chemistry, materials, chemical engineering, mechanical engineering, or electronic engineering should be enough.
INDUSTRY SUPPORT : Electronic Device Manufacturing
Lectures
Week 1: Substrate and Cleaning
Week 2: Additive Processing: Defects and Diffusion
Week 3: Additive Processing: Native films
- Ion Implantation Contd
- Native Films
- Native Films: Advanced Concepts
- Native Films: Defects at Si/SiO2 interface
Week 4: Additive Processing: Chemical Vapor Deposition
- Methods and Some Definitions
- Chemical Vapor Depostion: Basics
- Chemical Vapor Depostion: Precursor Transport
- Chemical Vapor Depostion: Types of CVD Equipment
- Chemical Vapor Depostion: Nucleation and Growth
- Chemical Vapor Depostion: Other Details
Week 5: Material deposition- ALD & Physical Vapor Depostion
- Atomic Layer Depostion
- Atomic Layer Depostion Contd..
- Physical Vapor Deposition: Basics
- Physical Vapor Deposition: Evaporation
- Physical Vapor Deposition: Sputtering
Week 6: Metallization and Optical Lithography
- Metallization: Contact resistance
- Metallization: Electromigration and Epilogue
- Pattern Transfer Basics
- Optical lithography basics: resist process-1
- Optical lithography basics: resist process-2
Week 7: Optical Lithography 2
- Optical Lithography: Contact and Proximity printing
- Optical Lithography: Stepper and Scanner
- Projection Lithography: Image formation basics
- Projection Lithography: Image formation in photoresist
- Optical lithography: Surface Reflection
Week 8: Optical Lithography 3 & E-Beam Lithography
- Optical Lithography: Mask Technology
- Lithography process technology glossary
- Optical Lithography: Resolution enhancement
- Electron beam lithography: Basics
- Electron beam lithography: Resist process
- Emerging lithography techniques
Week 9: Wet Etching
Week 10 Dry Etch
- Dry etch: Plasma Basics
- Dry etch: Plasma etching basics
- Dry etch: Plasma tool configuration
- Dry etch: Etch mechanism
- Dry etch: Etch chemistry
Week 11 Process Integration
- Chemical Mechanical Polishing (CMP): Basics
- Chemical Mechanical Polishing (CMP): Tool and process
- Design for Manufacturability-1
- Design for Manufacturability-2
- Design for Manufacturability: Case study
Week 12: Process Integration
Syllabus and materials
At NPTEL, as the course publishes them.
Credits and licence
- Institution
- IISc Bangalore
- Department
- Electronics & Communication Engineering
- Taught by
- Prof. Sushobhan Avasthi, Prof. Shankar Selvaraja
- Level
- Undergraduate
- Language
- English
- Subjects
- Engineering, Society and politics
- Source
- NPTEL
- Licence
- CC BY-NC-SA, as NPTEL states it. Non-commercial use only. NPTEL's terms
- Attribution
- NPTEL states: "Distributed under Creative Commons Attribution-ShareAlike / CC BY - NC - SA", beside a BY-NC-SA badge.
- Who can watch
- NPTEL gives no rating. Invisible Network shows it to Teens profiles and older, judged from what the source says about it. How courses are placed