Learn · An Introduction to Electronics Systems Packaging

Lecture 37 of 42Surface Mount Technology

Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys

Prof. G.V. Mahesh · IISc Bangalore

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From
An Introduction to Electronics Systems Packaging, IISc Bangalore (at NPTEL)
Licence
CC BY-NC-SA, as NPTEL states it. Non-commercial use only.
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NPTEL states: "Distributed under Creative Commons Attribution-ShareAlike / CC BY - NC - SA", beside a BY-NC-SA badge.
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All the lectures

  1. Introduction and Objectives of the course Video
  2. Definition of a system and history of semiconductors Video
  3. Products and levels of packaging Video
  4. Packaging aspects of handheld products; Case studies in applications Video
  5. Case Study (continued); Definition of PWB, summary and Questions for review Video
  6. Basics of Semiconductor and Process flowchart; Video on Sand-to-Silicon Video
  7. Wafer fabrication, inspection and testing Video
  8. Wafer packaging; Packaging evolution; Chip connection choices Video
  9. Wire bonding, TAB and flipchip-1 Video
  10. Wire bonding, TAB and flipchip-2; Tutorials Video
  11. Why packaging? & Single chip packages or modules (SCM) Video
  12. Commonly used packages and advanced packages; Materials in packages Video
  13. Advances packages (continued); Thermal mismatch in packages; Current trends in packaging Video
  14. Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages Video
  15. Electrical Issues : I; Resistive Parasitic Video
  16. Electrical Issues : II; Capacitive and Inductive Parasitic Video
  17. Electrical Issues : III; Layout guidelines and the Reflection problem Video
  18. Electrical Issues : IV; Interconnection Video
  19. Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT Video
  20. Components of a CAD package and its highlights Video
  21. Design Flow considerations; Beginning a circuit design with schematic work and component layout Video
  22. Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability Video
  23. Review of CAD output files for PCB fabrication; Photo plotting and mask generation Video
  24. Process flow-chart; Vias; PWB substrates Video
  25. Substrates continued; Video highlights; Surface preparation Video
  26. Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs Video
  27. PWB etching; Resist stripping; Screen-printing technology Video
  28. Through-hole manufacture process steps; Panel and pattern plating methods Video
  29. Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias Video
  30. Microvia technology and Sequential build-up technology process flow for high-density interconnects Video
  31. Conventional Vs HDI technologies; Flexible circuits; Tutorial session Video
  32. SMD benefits; Design issues; Introduction to soldering Video
  33. Reflow and Wave Soldering methods to attach SMDs Video
  34. Solders; Wetting of solders; Flux and its properties; Defects in wave soldering Video
  35. Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures Video
  36. SMT failure library and Tin Whiskers Video
  37. Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys Video
  38. Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues Video
  39. Thermal Design considerations in systems packaging Video
  40. Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes Video
  41. Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging Video
  42. Chapter-wise summary Video