Learn · Fundamentals of electronic device fabrication
Lecture 40 of 40Electronic materials, devices, and fabrication
IC circuit logic and packaging
Prof. Parasuraman S · IIT Madras
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- Fundamentals of electronic device fabrication, IIT Madras (at NPTEL)
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- CC BY-NC-SA, as NPTEL states it. Non-commercial use only.
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All the lectures
- Metals, semiconductors, and insulators
- Introduction to semiconductors
- Density of states and Fermi-Dirac statistics
- Assignment 1 - Bonding, DOS, and Fermi statistics
- Intrinsic semiconductors
- Intrinsic semiconductors - conductivity
- Assignment 2 - Intrinsic semiconductors
- Extrinsic semiconductors
- Extrinsic semiconductors - Fermi level
- Extrinsic semiconductors - conductivity
- Assignment 3 - Extrinsic semiconductors
- Metal-semiconductor junctions
- Assigment 4 - Metal-semiconductor junctions
- pn junctions in equilibrium
- pn junctions under bias
- pn junction breakdown and heterojunctions
- Assignment 5 - pn junctions
- Transistors
- MOSFETs
- Assignment 6 - transistors
- Optoelectronic devices: Introduction
- Optoelectronic devices: LEDs
- Optoelectronic devices: LASERs
- Optoelectronic devices: photodetector
- Optoelectronic devices: solar cells
- Assignment 7 - optical properties
- Assignment 8 - optoelectronic devices
- Semiconductor manufacturing: Introduction
- Si wafer manufacturing
- IC device manufacturing: overview
- Layering: thermal oxidation
- Doping: thermal and ion implantation
- Lithography
- Etching and deposition (growth)
- Metallization and polishing
- Process and device evaluation
- Productivity and process yield
- Clean room design and contamination control
- Devices and IC formation
- IC circuit logic and packaging