Course11210600540 lectures
Thermal Management of Electronics
Prof. Sarthak Nag and Prof. Parmod Kumar · IIT Mandi
About
This course is designed to provide a comprehensive understanding of heat generation, dissipation, and control in modern electronic systems. It begins with a refresher on heat transfer fundamentals and progresses through passive and active cooling techniques, including cutting-edge solutions like two-phase cooling and additive-manufactured heat sinks. With real-world case studies and applications spanning consumer devices to power electronics and data centers, the course equips learners with the tools to design thermally efficient and reliable electronic systems.
Intended audience: Industry professionals (semiconductor packaging , electric vehicles), UG/PG students from educational institutes
Prerequisites: Thermodynamics, Fluid Mechanics, Heat Transfer
Lectures
Week 1
- Introduction to thermal management in electronics
- Heat transfer mechanisms and conduction heat transfer
- Heat diffusion equation and thermal resistance network
- Spreading resistance and thermal interface materials
- Convective heat transfer and introduction to boundary layer
Week 2
- Velocity and temperature boundary layers
- External forced convection heat transfer
- Internal forced convection heat transfer
- Natural convection heat transfer
- Radiation heat transfer
Week 3
- Radiation exchange between surfaces
- Flow and temperature measurement
- Thermal specification of microelectronics packaging
- Natural convection cooling
- Enclosures design for natural cooling, orientation effects
Week 4
- Forced air cooling, flow regimes and fan selection and placement
- Fan performance curves, system curves, fan selection and placement
- Fin and heat sinks, applications
- Heat sinks
- Heat sinks design parameters
Week 5
- Overview and need of liquid cooling
- Fundamentals of cold plates
- Fundamentals of microchannel heat sinks
- Heat transfer in microchannels
- Numerical problems on microchannel heat transfer
Week 6
- Fundamentals of boiling heat transfer
- Flow boiling in micro and macrochannels
- Direct immersion cooling
- Heat pipes
- Heat pipes- performance limits
Week 7
- Heat pipes-modelling and materials selections
- Vapour chamber, loop heat pipes and pulsating heat pipes
- Thermal management of electronics using Phase change material (PCM)
- Resistance capacitance netwrork for PCM heat sinks
- Overview of jet impingement and thermoelectric cooling
Week 8
- Thermal management of electric vehicles
- Thermal management of EVs (contd.) and Data centers
- Thermal management of Data centers: rack-level and chip-level cooling
- Data centers immersion cooling, Microbubble based liquid cooling & Monolithic microchannels
- Cooling trends and future directions in thermal management
Syllabus and materials
At NPTEL, as the course publishes them.
Credits and licence
- Institution
- IIT Mandi
- Department
- Mechanical Engineering
- Taught by
- Prof. Sarthak Nag, Prof. Parmod Kumar
- Level
- Undergraduate
- Language
- English
- Subjects
- Engineering
- Source
- NPTEL
- Licence
- CC BY-NC-SA, as NPTEL states it. Non-commercial use only. NPTEL's terms
- Attribution
- NPTEL states: "Distributed under Creative Commons Attribution-ShareAlike / CC BY - NC - SA", beside a BY-NC-SA badge. Coordinated by IIT Madras.
- Who can watch
- NPTEL gives no rating. Invisible Network shows it to Tweens profiles and older, judged from what the source says about it. How courses are placed