Learn · Electrical Engineering 143 - Fall 2014
Lecture 3 of 212014-09-231 h 22 min
Electrical Engineering 143 - 2014-09-23: Lithography II: Optics, Resolution, Alignment Accuracy
Clark Tu-cuong Nguyen · University of California, Berkeley
Credits and licence
- From
- Electrical Engineering 143 - Fall 2014, University of California, Berkeley (at Internet Archive)
- Licence
- Internet Archive states no licence for it.
- Attribution
- Copyright UC Regents 2014
- Who can watch
- Tweens profiles and older. How courses are placed
All the lectures
- Electrical Engineering 143 - 2014-09-16:Layout to Cross-Section, Design Rules
- Electrical Engineering 143 - 2014-09-18: Lithography I: Radiation Sources, Masks, Photoresist
- Electrical Engineering 143 - 2014-09-23: Lithography II: Optics, Resolution, Alignment Accuracy
- Electrical Engineering 143 - 2014-09-25: Oxidation I: Thermal Oxidation Models, Deposition Methods
- Electrical Engineering 143 - 2014-09-30: Oxidation II: Graphs, Dopant Redistribution, Device Isolation
- Electrical Engineering 143 - 2014-10-02: Physical Film Deposition: Evaporation, Sputtering
- Electrical Engineering 143 - 2014-10-07: Chemical Film Deposition -- LPCVD, PECVD, ALD, Epitaxy
- Electrical Engineering 143 - 2014-10-09: Etching I -- Anisotropy, Selectivity, Wet Etching
- Electrical Engineering 143 - 2014-10-14: Ion Implantation I -- Etching II: Plasma Etching, Reactive Ion Etching
- Electrical Engineering 143 - 2014-10-16: Ion Implantation I -- Range & Straggle, Lateral Straggle, Jcn. Depth
- Electrical Engineering 143 - 2014-10-21: Ion Implantation II -- I/I Through Layers, Tables
- Electrical Engineering 143 - 2014-10-23: Diffusion I -- Predeposition, Drive-In, Modeling
- Electrical Engineering 143 - 2014-10-28: Diffusion II: 2-Step Diffusion, Successive Diffusions, Lateral Diffusion
- Electrical Engineering 143 - 2014-11-04: Diffusion III: Series Resistance, Irvin’s Curves, Concentration Dep.
- Electrical Engineering 143 - 2014-11-06: Interconnects: Contacts, Metallization, Silicides, Damascene Proc.
- Electrical Engineering 143 - 2014-11-13: Metal MEMS, Adv. CMOS I: Device Structure, Process Flow
- Electrical Engineering 143 - 2014-11-18: Adv. CMOS II: Process Flow (cont.), Punchthrough
- Electrical Engineering 143 - 2014-11-20: Adv. Isolation: Problems w/ LOCOS, Trench Isolation
- Electrical Engineering 143 - 2014-11-25: Device Characterization I: MOS-CV Curve --> xox, Na, VFB
- Electrical Engineering 143 - 2014-12-02: Vt Implant: Threshold Voltage, Shallow vs. Deep Vt Implant
- Electrical Engineering 143 - 2014-12-04: Device Characterization II: MOS Device Models, MOS IV Curve --> L, W, mobility, Body effect; Latch-Up, Course Wrap Up