Podcasts · The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations
Why Chip Designers Are Embracing Multi-Die Simulation
· 7:19 · S1 E48
Episode Why Chip Designers Are Embracing Multi-Die Simulation
Episode 48 dives into the growing complexity of simulating multi-die chip designs, where chiplets and advanced packaging create new verification challenges. Lucas and Luna explore how EDA tools are evolving to handle system-level thermal, power, and signal integrity issues that single-die designs never faced. With specific data on simulation time blow-ups and real examples from the latest design flows, they examine why multi-die simulation is becoming a bottleneck—and the techniques engineers are using to break through. A must-hear for anyone following the shift to heterogeneous integration.
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Transcript
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