Podcasts · The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations
How Chips Are Using Glass Substrates to Beat Silicon Limits
· 8:07 · S2 E66
Episode How Chips Are Using Glass Substrates to Beat Silicon Limits
Episode 66 of The Hardware Podcast. Lucas and Luna explore glass substrates for chip packaging — a material shift that could reshape how processors handle bandwidth, heat, and interconnect density. They discuss why Intel and Samsung are investing in glass core substrates, the manufacturing challenges at scale, and how this technology could enable faster AI accelerators and data-center chips. Specific numbers: glass substrates can reduce signal loss by 30% compared to organic materials and support 50% finer line widths. The hosts explain why glass is suddenly viable after decades of being dismissed as too brittle, and what it means for the next generation of heterogeneous integration. No hype — just the engineering reality.
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Transcript
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