# How Chips Are Using Chiplets to Beat Moore Law Limits

An episode of [The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations](https://invisiblenetwork.ai/podcast/1896799982), 26 Jun 2026, 11 min.

Audio: https://audio.fexingo.com/business/the-hardware-podcast/episode-0075.mp3

Episode 75 of The Hardware Podcast with Fexingo. Lucas and Luna dive into the chiplet revolution—why the industry is moving from monolithic chips to modular, multi-die packages. They break down AMD's successful chiplet strategy with EPYC and Ryzen processors, compare it with Intel's delayed Ponte Vecchio GPU, and explore the technical challenges of die-to-die interconnects like Universal Chiplet Interconnect Express (UCIe). The hosts also touch on how chiplet architectures allow designers to mix process nodes, reducing cost and improving yields. Along the way, they acknowledge listener support as the reason the show stays ad-free, with a link to buy me a coffee dot com slash fexingo. Perfect for hardware engineers, semiconductor enthusiasts, and anyone curious about the future of chip design. #Chiplets #AMD #Intel #UCIe #Semiconductors #MooreLaw #ChipDesign #DieToDie #AdvancedPackaging #EPYC #Ryzen #PonteVecchio #ProcessNodes #Technology #HardwarePodcast #FexingoBusiness #BusinessPodcast #Podcast Keep every episode free: buymeacoffee.com/fexingo

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